High Current Properties of a Microspring Contact for Flip Chip Packaging
نویسندگان
چکیده
The high current properties of a micro spring pressure contact are characterized. The spring has large compliance (>30 μm) compared to other packaging technologies and fits in a 180 μm pitch 2d array. At 250 mA and 65 ̊C, daisy chains of 134 spring contacts in a silicon package show stable resistances and hotspot temperature rises of less than a degree. At 1 amp, failure near the spring tip or body is observed. Finite element modeling is performed to study the current distribution and provide failure mode insight. Simultaneous force and resistance measurements suggest there is no spring force softening. The results suggest a 10 mg (100 μΝ) micro spring with large compliance can be reliable for high current applications.
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